TW257745B - - Google Patents

Info

Publication number
TW257745B
TW257745B TW083105588A TW83105588A TW257745B TW 257745 B TW257745 B TW 257745B TW 083105588 A TW083105588 A TW 083105588A TW 83105588 A TW83105588 A TW 83105588A TW 257745 B TW257745 B TW 257745B
Authority
TW
Taiwan
Application number
TW083105588A
Other languages
Chinese (zh)
Original Assignee
Towa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27328135&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW257745(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP5202689A external-priority patent/JP2932136B2/ja
Priority claimed from JP5202690A external-priority patent/JP2932137B2/ja
Priority claimed from JP5343141A external-priority patent/JP2666041B2/ja
Application filed by Towa Kk filed Critical Towa Kk
Application granted granted Critical
Publication of TW257745B publication Critical patent/TW257745B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW083105588A 1993-07-22 1994-06-21 TW257745B (en])

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5202689A JP2932136B2 (ja) 1993-07-22 1993-07-22 電子部品の樹脂封止成形方法及び装置
JP5202690A JP2932137B2 (ja) 1993-07-22 1993-07-22 電子部品の樹脂封止成形方法及び装置
JP5343141A JP2666041B2 (ja) 1993-12-14 1993-12-14 電子部品の樹脂封止成形方法

Publications (1)

Publication Number Publication Date
TW257745B true TW257745B (en]) 1995-09-21

Family

ID=27328135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105588A TW257745B (en]) 1993-07-22 1994-06-21

Country Status (9)

Country Link
US (1) US5750059A (en])
KR (1) KR0164440B1 (en])
CN (2) CN1178286C (en])
DE (1) DE4426127C2 (en])
GB (2) GB2280141B (en])
MY (1) MY111277A (en])
NL (1) NL9401211A (en])
SG (2) SG54598A1 (en])
TW (1) TW257745B (en])

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123206A (ja) * 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
SG97124A1 (en) * 1996-08-20 2003-07-18 Apic Yamada Corp Resin molding machine
DE19709136A1 (de) * 1997-03-06 1998-09-10 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung und Magazinierung von Mikrobauteilen, Magazin und Montageverfahren für Mikrobauteile
US6523254B1 (en) * 2000-04-19 2003-02-25 Micron Technology, Inc. Method for gate blocking x-outs during a molding process
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
KR100409158B1 (ko) * 2001-11-19 2003-12-12 주식회사 경동보일러 유량센서에 의한 보일러 난방제어방법
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
JP3609824B1 (ja) * 2003-10-30 2005-01-12 第一精工株式会社 樹脂封止成形装置
CN100359419C (zh) * 2004-06-23 2008-01-02 中国科学院长春光学精密机械与物理研究所 一种用于微电子器件后封装加工设备的控制装置
TWI359069B (en) * 2004-11-02 2012-03-01 Apic Yamada Corp Resin molding equipment and resin molding method
NL1028907C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2008028189A (ja) * 2006-07-21 2008-02-07 Renesas Technology Corp 半導体装置の製造方法
ES2337860B8 (es) * 2007-12-19 2011-07-28 Airbus Operations, S.L. Procedimiento para la preparacion y limpieza de utiles de fabricacionde piezas de material compuesto, y dispositivo correspondiente.
KR100985390B1 (ko) * 2008-08-14 2010-10-05 주식회사 경동네트웍 온수 사용량 변동에 따라 순환펌프 출력을 가변시키는 보일러 및 그 제어방법
KR20120046633A (ko) * 2010-11-02 2012-05-10 삼성전자주식회사 반도체 패키지 몰딩 시스템 및 몰딩 방법
CN102983086B (zh) * 2012-12-14 2014-11-26 大连泰一精密模具有限公司 平面阵列贴片式低能耗环保型高精密集成电路封装模具
CN110497577A (zh) * 2019-08-21 2019-11-26 苏州旭芯翔智能设备有限公司 一种半导体元器件封装自动化注塑系统及其工作方法
CN110653878B (zh) * 2019-10-10 2025-01-24 安徽耐科装备科技股份有限公司 一种用于集成电路的冲流道设备

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
CH633465A5 (de) * 1978-09-01 1982-12-15 Buehler Ag Geb Anlage zur herstellung von verbundgussteilen durch umgiessen von einlegeteilen.
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting
JPS58128744A (ja) * 1982-01-28 1983-08-01 Nec Corp 半導体樹脂封入方式
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS59207635A (ja) * 1983-05-11 1984-11-24 Nec Kyushu Ltd 半導体素子の樹脂封止装置
US4513942A (en) * 1983-05-25 1985-04-30 Bourns, Inc. Plate molding apparatus with interlocking cavity plates
JPS59220931A (ja) * 1983-05-31 1984-12-12 Seiei Kosan Kk 集積回路用自動モ−ルデイング装置
US4575328A (en) * 1984-03-06 1986-03-11 Asm Fico Tooling, B.V. Automatic continuously cycleable molding apparatus
JPS60227426A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体樹脂封止装置におけるリ−ドフレ−ムと樹脂タブレツトの供給装置
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
NL8501394A (nl) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling Inrichting voor het met kunststof omhullen van elektronische componenten.
JPS61263229A (ja) * 1985-05-17 1986-11-21 Sumitomo Heavy Ind Ltd 半導体装置における樹脂封止装置
JP2605032B2 (ja) * 1987-03-27 1997-04-30 松下電工株式会社 電子部品封止成形装置
JP2684677B2 (ja) * 1988-05-25 1997-12-03 株式会社日立製作所 半導体装置の製造方法
GB2227707B (en) * 1988-12-24 1993-06-16 T & K Int Kenkyusho Kk Method of and device for seal molding electronic components with resin
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
SG52483A1 (en) * 1989-11-24 1998-09-28 Fico Bv Single strip moulding apparatus with means for exerting pressure
JPH0443653A (ja) * 1990-06-11 1992-02-13 Fujitsu Ltd モールドインラインシステム
US5116450A (en) * 1990-07-23 1992-05-26 Phillips Petroleum Company Molding apparatus
US5302103A (en) * 1991-10-10 1994-04-12 Gencorp Inc. Injection molding machine including quick-change mold assembly
KR100237564B1 (ko) * 1991-12-20 2000-01-15 김영환 반도체 패키지 성형용 금형
DE4204286A1 (de) * 1992-02-13 1993-08-19 Siemens Ag Arbeitsverfahren und maschinengruppe zum herstellen von standard-elektronik-elementen unterschiedlicher groesse
WO1993020996A1 (fr) * 1992-04-13 1993-10-28 Apic Yamada Corporation Procede et appareil de moulage par transfert
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5405255A (en) * 1992-11-24 1995-04-11 Neu Dynamics Corp. Encapsulaton molding equipment

Also Published As

Publication number Publication date
GB2280141B (en) 1998-02-25
DE4426127C2 (de) 2001-09-27
US5750059A (en) 1998-05-12
CN1308368A (zh) 2001-08-15
CN1099517A (zh) 1995-03-01
DE4426127A1 (de) 1995-02-02
GB2280141A (en) 1995-01-25
KR0164440B1 (ko) 1999-02-01
GB9413637D0 (en) 1994-08-24
HK1036689A1 (en) 2002-01-11
SG49740A1 (en) 1998-06-15
GB9700598D0 (en) 1997-03-05
KR950004503A (ko) 1995-02-18
CN1178286C (zh) 2004-12-01
NL9401211A (nl) 1995-02-16
MY111277A (en) 1999-10-30
GB2306382A (en) 1997-05-07
GB2306382B (en) 1998-02-18
SG54598A1 (en) 1998-11-16

Similar Documents

Publication Publication Date Title
FR2703947B1 (en])
FR04C0020I1 (en])
EP0712290A4 (en])
FR2705941B1 (en])
FR2701905B1 (en])
DK144093D0 (en])
FR2706942B1 (en])
TW257745B (en])
DK18793A (en])
FR2701701B1 (en])
FR2706591B1 (en])
IN184457B (en])
FR2706951B1 (en])
FR2706598B1 (en])
EP0710070A4 (en])
FR2704988B1 (en])
FR2706765B3 (en])
FR2706795B3 (en])
ES1024806Y (en])
IN183997B (en])
IN175260B (en])
ECSDI930136S (en])
IN182686B (en])
DK63394A (en])
ATA199793A (en])

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent